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HOOPS 2021 Toolkits Provide Enhanced Support for BIM Workflows, Strengthen Connections to Reduce Complexity of Application Development

Wednesday, January 27th 2021

Industry-leading software development toolkits also accelerate the development process while improving new format support, performance and scalability, and enhancing user experience

January 26, 2021 – BEND, OR – Tech Soft 3D, the leading provider of engineering software development toolkits, today announces the release of the HOOPS Visualize 2021, HOOPS Exchange 2021, HOOPS Publish 2021 and HOOPS Communicator 2021 industry-leading 3D software development toolkits (SDKs) that power world-class engineering applications across the globe.

HOOPS software development kits power applications with proven 3D technologies, including high performance 3D graphics for desktop, web and mobile, fast and accurate CAD data translation and 3D data publishing. With HOOPS SDKs, developers are able to reduce product development costs and bring applications to market faster.

“We continue to strengthen the connections between our toolkits to greatly reduce the complexity and development time of bringing a new application to market,” said Eric Vinchon, Vice President of Product Strategy at Tech Soft 3D. “These integrations improve the overall experience for our partners, and that is our main priority, always.”

HOOPS-2021

The 2021 versions of the HOOPS SDKs include:

  • HOOPS Exchange: Support for 3MF and other new format updates and improved support of Building Information Modeling (BIM) workflows for users of software for Architecture, Engineering and Construction (AEC).
  • HOOPS Visualize: Faster loading of large models to support BIM workflows, improved measurement operators, and Qt Quick support for cross-platform application development.
  • HOOPS Communicator: Supports new BIM workflows in web browsers such as 2D floorplan display, faster loading of IFC models, and improved rendering and camera controls for navigating AEC models.
  • HOOPS Publish: Improved Product Manufacturing Information (PMI) support in Technical Data Packages (TDP) to support model-based design (MBD).

Apple’s recent shift from Intel-based chips to their new ARM-based architecture requires developers to port their applications to provide the best user experience. In our 2021 HOOPS product releases we are providing a beta build of our toolkits to enable this process.

In addition, the Tech Soft 3D website has been updated with a free 90-day HOOPS Native Platform evaluation experience. Users can now interact with demos, videos, download a free evaluation, walk through tutorials, read partner success stories and browse the updated documentation, all in just a few clicks.

For more information or to sign up for a free trial, visit www.techsoft3d.com.

About Tech Soft 3D
Tech Soft 3D is the leading provider of engineering software development toolkits. Established in 1996 and headquartered in Bend, Oregon, Tech Soft 3D also has offices in California, France, England, Japan and Norway. The company’s toolkit products power more than 500 unique applications running on hundreds of millions of computers worldwide. Tech Soft 3D is backed by investment firm Battery Ventures. For more information, visit www.techsoft3d.com.

HOOPS is a registered trademark of Tech Soft 3D. All other products or company references are the property of their respective holders.

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